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  i ntegrated c ircuits d ivision ds-IX3180-r02 www.ixysic.com 1 features ? 2.5a maximum peak output current ? 20ns typical pulse width distortion ? 10kv/s minimum common mode rejection (cmr) at 1500v cm ? wide operating voltage range: 10v to 20v ? under voltage lockout with hysteresis ? 3750v rms input to output isolation ? wide temperature range: -40c to +100c ? 200ns maximum propagation delay over temperature range applications ? isolated power mosfet gate drive ? switch mode power supplies ? industrial inverters ? motor drivers description the IX3180 is a high speed mosfet gate drive optocoupler. it consists of an input infrared led that is optically coupled to an integrated power gate driver that is capable of sourcing and sinking 2.5a of peak current. the IX3180 is ideally suited for high frequency driving of power mosfets used in high performance dc/dc converters, motor cont rol inverter applications, and high performance switching power supplies. the IX3180 is available in an 8-pin dip package and an 8-pin surface mount package. approvals ? ul recognized component: file e76270 ordering information figure 1. IX3180 block diagram part description IX3180g 8-pin dip package (50/tube) IX3180gs 8-pin surface mount (50/tube) IX3180gstr 8-pin surface mount tape & reel (1000/reel) anode cathode v cc v o v ee n/c n/c v o 2 3 1 4 7 6 8 5 note: a 0.1 ? f bypass capacitor must be connected between pins 5 & 8. IX3180 2.5a output current high speed gate driver optocoupler
i ntegrated c ircuits d ivision 2 www.ixysic.com r02 IX3180 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 absolute maximum ratings @ 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.5 electrical specifications (dc). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 switching characteristics (ac) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.7 package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. performance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.1 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.2 esd sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.3 soldering profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.4 board wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.5 package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.5.1 IX3180g 8-pin dip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.5.2 IX3180gs 8-pin surface mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.5.3 IX3180gstr tape & reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
i ntegrated c ircuits d ivision IX3180 r02 www.ixysic.com 3 1. specifications 1.1 package pinout 1.2 pin description 1.3 absolute maximum ratings @ 25c n otes: 1 maximum pulse width=10 ? s, maximum duty cycle=0.2%. 2 derate linearly 0.66mw/c 3 derate linearly 7.5mw/c absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 2 3 8 5 6 7 anode cathode v cc v o v ee n/c n/c 1 4 v o pin# name description 1 n/c no connection 2 anode anode of input led 3 cathode cathode of input led 4 n/c no connection 5 v ee negative supply voltage 6 v o gate drive output 7 v o gate drive output 8 v cc positive supply voltage parameter symbol limit units supply voltage v cc - v ee -0.5 to 25 v output voltage v o(peak) 0 to v cc v ?high? peak output current 1 i oh(peak) - 2.5 a ?low? peak output current 1 i ol(peak) 2.5 a reverse input voltage v r 5v average input current i f(avg) 20 ma peak transient input current (<1 ?
i ntegrated c ircuits d ivision 4 www.ixysic.com r02 IX3180 1.4 recommended operating conditions 1.5 electrical specifications (dc) over recommended operating conditions unless other wise specified. typical values are at t a =25c. 1 maximum pulse width = 50 ? s, maximum duty cycle = 0.5%. 2 maximum pulse width = 10 ? s, maximum duty cycle = 0.2%. see ?test circuits? on page 8 for more information. parameter symbol min max units power supply voltage v cc - v ee 10 20 v input current (on) i f(on) 10 16 ma input voltage (off) v f(off) -3.6 0.8 v operating temperature t a -40 100 c parameter conditions symbol min typ max units high level output current v o =(v cc -4v) 1 i oh - 0.5 - - a v o =(v cc -10v) 2 - 2 - - low level output current v o =(v ee +2.5v) 1 i ol 0.5 - - a v o =(v ee +10v) 2 2-- high level output voltage i o =-100ma v oh v cc - 1 --v low level output voltage i o =100ma v ol --0.5v high level supply current output open, i f =10 to 16ma i cch -36 ma low level supply current output open, v f =- 3 to +0.8v i ccl -36 threshold input current, low-to-high i o =0ma, v o >5v i flh --8ma threshold input voltage, high-to-low - v fhl 0.8 - - v input forward voltage i f =10ma v f 1 1.35 1.7 v temperature coefficient of forward voltage i f =10ma ? v f / ? t a --1.4-mv/c input reverse breakdown voltage i r =10 ? abv r 5-- v input capacitance f=1mhz, v f =0v c in -30- pf uvlo threshold v o >5v, i f =10ma v uvlo+ -8.7- v v uvlo- -8.1- uvlo hysteresis v o >5v, i f =10ma uvlo hys -0.6- v
i ntegrated c ircuits d ivision IX3180 r02 www.ixysic.com 5 1.6 switching characteristics (ac) over recommended operating conditions, unless otherwise specified. 1 the difference between t phl and t plh of any two IX3180 devices operating under the same conditions and temperature. figure 2. timing waveforms 1.7 package characteristics parameter conditions symbol min typ max units propagation delay time to high output level r g =10 ? , c g =10nf f=250khz, duty cycle=50% t plh 50 85 200 ns propagation delay time to low output level t phl 50 100 200 pulse width distortion pwd |t phl -t plh | -2065 propagation delay difference between any two parts 1 pdd (t phl -t plh ) -90 - 90 rise time t r -25- fall time t f -25- uvlo turn-on delay v o >5v, i f =10ma t uvlo(on) -2- ? s uvlo turn-off delay v o <5v, i f =10ma t uvlo(off) -0.3- output high level common mode transient immunity i f =10 to 16ma, v cm =1500v, v cc =20v, t a =25c |cm h | 10 - - kv/ ? s output low level common mode transient immunity v f =0v, v cm =1500v, v cc =20v, t a =25c |cm l | 10 - - i f v out t plh t phl 90% 50% 10% t r t f parameter conditions symbol rating units isolation test voltage - v iso 3750 v rms input-output momentary withstand voltage rh < 50%, t = 1 min, t a = 25c v iso 3750 v rms resistance (input-output), typical v i-o = 500v dc r i-o 10 12 ? capacitance (input-output), typical f = 1 mhz c i-o 0.6 pf
i ntegrated c ircuits d ivision 6 www.ixysic.com r02 IX3180 2. performance data temperature (oc) -50 -25 0 25 50 75 100 125 output current (a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i ol vs. temperature (v f(off) =-3v to 0.8 v, v out =2.5v, v cc =10v, v ee =0v) temperature (oc) -40 -20 0 20 40 60 8 0 100 v ol (v) 0.00 0.05 0.10 0.15 0.20 v ol vs. temperature (i ol = 100ma, v f(off) =-3v to 0.8 v, v cc =10v to 20v, v ee =0v) output current (a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output volta g e drop = v oh -v cc (v) -5 -4 -3 -2 -1 0 v oh vs. i oh (i f =10ma, v cc =10v, v ee =0v) t a = -40oc t a = 25oc t a = 100oc temperature (oc) -50 -25 0 25 50 75 100 125 output current (a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i oh vs. temperature (i f =10ma, v out =v cc -4v, v cc =10v, v ee =0v) temperature (oc) -40 -20 0 20 40 60 8 0 100 v cc -v oh (v) 0.00 0.05 0.10 0.15 0.20 v oh vs. temperature (i oh = -100ma, i f =10ma to 16ma, v cc =10v to 20v, v ee =0v) output current (a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 output volta g e drop = v ol (v) 0 1 2 3 4 5 v ol vs. i ol (v f(off) =-3v to 0.8 v, v cc =10v, v ee =0v) t a = 100oc t a = 25oc t a = -40oc v cc (v) 10 12 14 16 1 8 20 22 i cc (ma) 0 1 2 3 4 supply current - i cc vs. supply volta g e - v cc (t a =25oc, v ee =0v) i cch (i f =10ma) i ccl (i f =0ma) temperature (oc) -40 -20 0 20 40 60 8 0 100 i cc supply current (ma) 0 1 2 3 4 i cc vs. temperature (v cc =20v, v ee =0v) i ccl (i f =0ma) i cch (i f =10ma) temperature (oc) -40 -20 0 20 40 60 8 0 100 i flh (ma) 1.5 2.0 2.5 3.0 3.5 i f low-to-hi g h threshold vs. temperature (v cc =10v to 20v, v ee =0v, output=open) i f (ma) 8 10 12 14 16 1 8 t p (ns) 0 50 100 150 200 250 propa g ation delay vs. i f (v cc =20v, v ee =0v, r g =10, c g =10nf, f=250khz, duty cycle=50%) t phl t plh v cc (v) 10 15 20 25 propa g ation delay (ns) 0 50 100 150 200 250 propa g ation delay vs. v cc (i f =10ma, r g =10, c g =10nf, f=250khz, duty cycle=50%) t phl t plh temperature (oc) -40 -20 0 20 40 60 8 0 100 t p (ns) 0 50 100 150 200 250 t phl t plh propa g ation delay vs. temperature (i f =10ma, v cc =20v, v ee =0v, r g =10, c g =10nf, f=250khz)
i ntegrated c ircuits d ivision IX3180 r02 www.ixysic.com 7 i f - forward led current (ma) 012345 v o - output volta g e (v) 0 5 10 15 20 25 transfer characteristic c g (nf) 510152025 propa g ation delay (ns) 50 70 90 110 130 150 propa g ation delay vs. c g (v cc =20v, i f =10ma, r g =10 , f=250khz, duty cycle=50%) t phl t plh r g () 10 15 20 25 30 35 40 45 50 porpa g ation delay (ns) 50 70 90 110 130 150 propa g ation delay vs. r g (v cc =20v, i f =10v, c g =10nf, f=250khz, duty cycle=50%) t phl t plh forward volta g e (v) 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 input current (ma) 0 10 20 30 40 50 input current vs. forward volta g e (t a =25oc)
i ntegrated c ircuits d ivision 8 www.ixysic.com r02 IX3180 3. test circuits t plh , t phl , t r , t f test circ uit 2 3 1 4 7 6 8 5 i f =10 to 16ma 0.1f v cc =20v + - v o r g 10 c g 10nf 500 + - 10khz 50% duty cycle v oh test circ uit i ol test circ uit v ol test circ uit i flh test circ uit uv lo test circuit i oh test circ uit 2 3 1 4 7 6 8 5 i f =10 to 16ma 0.1f v cc =10 to 20v + - + - 4v i oh 2 3 1 4 7 6 8 5 0.1f v cc =10 to 20v + - i ol + - 2.5v 2 3 1 4 7 6 8 5 i f =10 to 16ma 0.1f v cc =10 to 20v + - v oh 100ma 2 3 1 4 7 6 8 5 0.1f v cc =10 to 20v + - v ol 100ma 2 3 1 4 7 6 8 5 i f =10ma 0.1f v cc + - v o >5v 2 3 1 4 7 6 8 5 0.1f v cc =10 to 20v + - v o >5v i f
i ntegrated c ircuits d ivision IX3180 r02 www.ixysic.com 9 4. manufacturing information 4.1 moisture sensitivity all plastic encapsulated semiconductor packages are susc eptible to moisture ingression. ixys integrated circuits division clas sified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 4.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 4.3 soldering profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. 4.4 board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated ci rcuits division employs the us e of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. chlorine-based or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ul trasonic energy should not be used. device moisture sensitivity level (msl) rating IX3180g / IX3180gs msl 1 device maximum temperature x time maximum reflow cycles IX3180g / IX3180gs 250c for 30 seconds 3
i ntegrated c ircuits d ivision 10 www.ixysic.com r02 IX3180 4.5 package mechanical dimensions 4.5.1 IX3180g 8-pin dip 4.5.2 IX3180gs 8-pin surface mount dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1
i ntegrated c ircuits d ivision IX3180 r02 www.ixysic.com 11 4.5.3 IX3180gstr tape & reel dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 4 81-2 2. tape complies w ith all ?notes? for constant dimensions listed on page 5 of eia-481-2 embossment emb ossed carrier top co v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) for additional information please visit our website at: www.ixysic.com ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. n either circuit patent licenses nor indemnity are expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, i xys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its pr oducts at any time without notice. specification: ds-IX3180-r02 ?copyright 2015, ixys integrated circuits division all rights reserved. printed in usa. 1/6/2015


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